W25Q64DW
10.2.25 Chip Erase (C7h / 60h)
The Chip Erase instruction sets all memory within the device to the erased state of all 1s (FFh). A Write
Enable instruction must be executed before the device will accept the Chip Erase Instruction (Status
Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the
instruction code “C7h” or “60h”. The Chip Erase instruction sequence is shown in Figure 24.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Chip Erase
instruction will not be executed. After /CS is driven high, the self-timed Chip Erase instruction will
commence for a time duration of t CE (See AC Characteristics). While the Chip Erase cycle is in progress,
the Read Status Register instruction may still be accessed to check the status of the BUSY bit. The BUSY
bit is a 1 during the Chip Erase cycle and becomes a 0 when finished and the device is ready to accept
other instructions again. After the Chip Erase cycle has finished the Write Enable Latch (WEL) bit in the
Status Register is cleared to 0. The Chip Erase instruction will not be executed if any page is protected by
the Block Protect (CMP, SEC, TB, BP2, BP1, and BP0) bits (see Status Register Memory Protection
table).
/CS
/CS
CLK
Mode 3
Mode 0
0
1
Mode 3
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Mode 3
In structio n
CLK
Mode 0
Instruction (C7h/60h)
Mode 0
IO 0
C7h/60h
DI
(IO 0 )
IO 1
DO
(IO 1 )
High Impedance
IO 2
IO 3
Figure 24. Chip Erase Instruction for SPI Mode (left) or QPI Mode (right)
- 48 -
相关PDF资料
W25Q64FVSFIG IC SPI FLASH 64MBIT 16SOIC
W25Q80BVSNIG IC SPI FLASH 8MBIT 8SOIC
W25Q80BWSSIG IC FLASH SPI 8MBIT 8SOIC
W25X40BVZPIG IC SPI FLASH 4MBIT 8WSON
W25X64VZEIG IC FLASH 64MBIT 75MHZ 8WSON
W25X80AVDAIZ IC FLASH 16MBIT 100MHZ 8DIP
W29GL032CB7A IC FLASH 32MBIT 70NS 48TFBGA
W29GL064CB7S IC FLASH 64MBIT 70NS 48TSOP
相关代理商/技术参数
W25Q64DWZEIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64DWZPIG 功能描述:IC FLASH SPI 64MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:1 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:4G(256M x 16) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP I 包装:Digi-Reel® 其它名称:557-1461-6
W25Q64DWZPIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVDAIG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVDAIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVSFIG 功能描述:IC SPI FLASH 64MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M(256K x 18) 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x20) 包装:托盘
W25Q64FVSFIG TR 制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 16SOIC
W25Q64FVSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI